Linwave diodes are available in screw based, push fit, cavity, strip-line and surface mount packages as standard; with single or double die configurations. Our production facility is experienced in servicing commercial, automotive and defence markets, and has exposure to producing components for space applications. It is staffed by a team of highly skilled and dedicated individuals with many years experience of semiconductor packaging and test activity. This is complemented by the extensive design & manufacturing facilities across the other Technology Pillars of Amplifiers, Transceivers, Sources and QFN Hybrids.
Linwave can offer device optimisation and performance characterisation up to 94GHz. Extensive knowledge allows Linwave Technology to offer solutions that optimize:
- Control of Thermal Resistance / Circuit Parasitics
- Use of copper based packages for improved heat dissipation
- Use of metal matrix composites in chip packages
Linwave Technology is also able to offer a packaging solution for obsolescence solutions including like-for-like replacements and custom specified upgrades.