LEMS offer a wide range of RF and Microwave diodes. LEMS can offer standard diodes and custom packaging solutions. The diodes are available in screw based, push fit, cavity, stripline and surface mount packages as standard, and in single or double die configurations. The production facility is currently active in servicing commercial, automotive and defence markets, and has experience in producing components for space applications. It is staffed by a team of highly skilled and dedicated individuals with many years experience of semiconductor packaging and test activity. This is complemented by the existing extensive design, development, manufacturing facilities and staff of Linwave Technology Ltd.

LEMS can offer device optimisation and performance characterisation up to 94GHz. Extensive knowledge allows LEMS to offer solutions that optimize:

• Control of Thermal Resistance / Circuit Parasitics
• Use of copper based packages for improved heat dissipation
• Use of metal matrix composites in chip packages

LEMS are also able to offer a packaging solution for obsolescence solutions including like-for-like replacements and custom specified upgrades

For further information please contact us at enquiries(at)remove-thislinwave.co.ukremove-this.

A range of PIN diodes were required to fit into a number of x-band solid state limiter products to provide both passive and active protection to receiver sets. Suitable die were identified, but these could not be procured economically in the package outlines required. The solution was to source the packages and perform the die mount, ribbon bond, seal and test processes internally to provide a complete diode assembly that could then be used in other products. This enabled a range of PIN diodes to be produced with specific characteristics for a variety of applications. In addition, diodes produced in this way can be fully characterised and optimized on site for DC, RF and thermal properties.