LEMS provides a state of the art semiconductor & MMIC assembly, packaging and test facility. Approximately 2,000 sq ft of temperature controlled class 10,000 cleanroom, with local area class 100 lamnar flow. LEMS boast a wide range of state of the art equipment including:

• Automated Optical Inspection (AOI) facilities.
• Thermosonic, epoxy and eutectic die mount capability. 
• Ball, wedge and tape bond capability down to 7.5µm wire size.
• Hermetic sealing capability using eutectic, projection welding and glob top techniques.
• Substrate separation capability.
• RF test, measurement and characterization capability up to 94GHz.